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US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on July 28 for "Sealing method for direct liquid cooled power electronics package" (South Korean, American Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,430, issued on July 28, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.). "Sealing method for direct liquid cool... Read More


US Patent Issued to BYD on July 28 for "Motor controller and vehicle with the same" (Chinese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,431, issued on July 28, was assigned to BYD Co. Ltd. (Shenzhen, China). "Motor controller and vehicle with the same" was invented by Fengch... Read More


US Patent Issued to Huawei Technologies on July 28 for "Energy-saving method applied to machine room, apparatus, and system" (Chinese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,432, issued on July 28, was assigned to Huawei Technologies Co. LTD. (Shenzhen, China). "Energy-saving method applied to machine room, appa... Read More


US Patent Issued to SAMSUNG DISPLAY on July 28 for "Electronic device" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,433, issued on July 28, was assigned to SAMSUNG DISPLAY Co. LTD. (Yongin-si, South Korea). "Electronic device" was invented by Jangun Choi ... Read More


US Patent Issued to Murata Manufacturing on July 28 for "Module" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,434, issued on July 28, was assigned to Murata Manufacturing Co. Ltd. (Kyoto-fu, Japan). "Module" was invented by Yoshihito Otsubo (Nagaoka... Read More


US Patent Issued to INTERNATIONAL BUSINESS MACHINES on July 28 for "Data-analysis-based feedback of component positioning within an electronic assembly" (New York Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,435, issued on July 28, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Data-analysis-based feedback of component po... Read More


US Patent Issued to INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES on July 28 for "Three-dimensional static random-access memory and preparation method therefor" (Chinese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,436, issued on July 28, was assigned to INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES (Beijing). "Three-dimensional static ran... Read More


US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor devices having contact plugs" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,437, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor devices having contact plugs" ... Read More


US Patent Issued to Micron Technology on July 28 for "Support structure for multiple, alternating epitaxial silicon" (Idaho Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,438, issued on July 28, was assigned to Micron Technology Inc. (Boise, Idaho). "Support structure for multiple, alternating epitaxial silic... Read More


US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor device including an insulating structure on a sidewall of a landing pad" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,439, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device including an insulating... Read More